Conference on Electronic System-integration Technology (ESTC)
The 5th ESTC Conference will be held on 16–18 September 2014 in Helsinki, Finland. The conference is the premier European event in the field of microelectronics packaging and integration. The event offers you the best opportunity to hear the latest news and developments in this field. Both academics and industry leaders will be attending the conference to discuss and debate about the state-of-the-art and future trends.
Second call for papers
ESTC 2014 seeks original papers describing research in all areas of electronic packaging and system integration. Kindly, submit your abstracts, with non-commercial information, of new developments and knowledge in the areas of but not limited to examples given for each technical track:
- 3D Integrations and embedding technologies
- Advanced technologies for emerging systems
- Assembly and manufacturing technologies
- Materials for interconnects and packaging
- MEMS/NEMS packaging
- Co-design and multiphysics system modelling
- Optoelectronic systems packaging
- Power electronic systems packaging
- Printable electronics
- Reliability of electronic devices and systems
Key dates
- Conference will be open for abstracts: 2 January 2014
- Submission of abstracts: 14 February 2014
- Submission for PD course proposals: 14 February 2014
- Notification of paper acceptance: 31 March 2014
- Final papers due: 20 June 2014
Organized by IEEE-CPMT since 2006, the Electronics System Integration Technology Conferences ESTCconference series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.
Further information
- estc2014.eu
- Gilles Poupon, Program Chair, gilles.poupon@cea.fr
- Professor Mervi Paulasto-Kröckel, Aalto University, mervi.paulasto@aalto.fi